Title :
Characterisation of metal coated polymer balls for BGA and CSP applications
Author :
Kristiansen, Helge ; Whalley, David ; Tyldum, Hallvard ; Redford, Keith
Author_Institution :
Conpart AS, Skjetten
Abstract :
A metal-coated ball based on a polymer core is under development for chip scale packaging (CSP) and ball grid array (BGA) applications. Different polymer cores have been produced and evaluated in order to optimise the mechanical properties of the ball. From a range of candidates with highly diverse properties, a candidate material has been proposed. This decision is based on a combination of a very low thermal expansion coefficient of 25 ppM/0C and E-modulus, which is of the order of 600 MPa.
Keywords :
ball grid arrays; chip scale packaging; polymerisation; polymers; thermal expansion; BGA; CSP; E-modulus; ball grid array; chip scale packaging; metal coated polymer balls; thermal expansion coefficient; Assembly; Chip scale packaging; Electronics packaging; Instruments; Mechanical factors; Optical polymers; Polymer films; Soldering; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074221
