• DocumentCode
    2073114
  • Title

    Influence of wavelength on laser sintering characteristics of Ag nanoparticles

  • Author

    Maekawa, Katsuhiro ; Yamasaki, Kazuhiko ; Niizeki, Tomotake ; Mita, Mamoru ; Matsuba, Yorishige ; Terada, Nobuto ; Saito, Hiroshi

  • Author_Institution
    Ibaraki Univ., Hitachi
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1579
  • Lastpage
    1584
  • Abstract
    The purpose of this study is to develop a dry process for minute wiring or interconnections without any wet process such as chemical etching and electroplating. The process is based on the use of metal nanoparticles and their metallization by laser sintering, which will bring a desktop manufacturing of electronic circuits in view. The present paper investigates the influence of wavelength on laser sintering characteristics of Ag nanoparticles, in which a CW Nd:YAG laser (1064 nm in wavelength), a CW laser diode (980 nm), a CW green laser (532 nm) and a CW Ar+ laser (488 nm) are employed. Sintering mechanism as well as adhesion to a polyimide substrate is extensively investigated by FIB observation and tensile-shear testing. As a result, the lasers with visible wavelength are preferable from the viewpoint of laser output and adhesion strength because of a high absorbance of light in the NanoPastereg containing Ag nanoparticles, a dispersant and solvents. On the other hand, the near-infrared lasers yield a denser sintered structure, which leads to lower specific resistance, although it is a couple of times high compared to furnace curing.
  • Keywords
    adhesion; focused ion beam technology; laser sintering; metallisation; nanoparticles; semiconductor lasers; silver; Ag; CW Nd:YAG laser; CW argon laser; CW green laser; CW laser diode; FIB; adhesion; desktop manufacturing; dispersant; dry process; interconnections; laser sintering; metal nanoparticles; metallization; minute wiring; near-infrared lasers; polyimide substrate; tensile-shear testing; wavelength 1064 nm; wavelength 488 nm; wavelength 532 nm; wavelength 980 nm; Adhesives; Chemical lasers; Chemical processes; Dry etching; Integrated circuit interconnections; Laser sintering; Metallization; Nanoparticles; Wet etching; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074224
  • Filename
    5074224