Title :
Novel on-chip high performance slow wave structure using discontinuous microstrip lines and multi-layer ground for compact millimeter wave applications
Author :
Wang, Guoan ; Woods, Wayne ; Ding, Hanyi ; Mina, Essam
Author_Institution :
IBM Semicond. Res. & Dev. Center, Essex Junction, VT
Abstract :
In this paper, a novel on chip slow wave structure is developed. It is built with discontinuous microstrip steps, the discontinuous line is made by placing a wide and short line and a narrow and short line in turn and the step discontinuity provides with additional inductance and capacitance. The slow wave transmission line structures were achieved through IBM 45 nm technology with multi-layer metals. Simulated and measured results for slow wave transmission line are provided in the paper for design with different characteristics impedances. Results have shown that the inductance per unit length and capacitance per unit length of the line increased about 50% compared with the conventional transmission line structure. In addition, the length effect of the wide and narrow signal sections is thoroughly studied and results have shown that the smaller the pitch, the better the slow wave effect which agrees with very well. A 75 GHz Branchline coupler built with the slow wave transmission lines has also been designed, and the coupler is 70% smaller than the conventional design.
Keywords :
microstrip lines; slow wave structures; strip line couplers; transmission lines; Branchline coupler; IBM technology; compact millimeter wave applications; discontinuous microstrip lines; frequency 75 GHz; on-chip high-performance slow wave structure; size 45 nm; slow wave transmission line structures; slow wave transmission lines; Arm; Capacitance; Coplanar waveguides; Fabrication; Impedance; Inductance; Microstrip; Periodic structures; Radio frequency; Transmission line discontinuities;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074229