Title :
Relationship between different mixing conditions and DC breakdown strength of high density polyethylene compound
Author :
Ueki, M.M. ; Zanin, M.
Author_Institution :
Dept. of Mater. Eng., Univ. Fed. de Sao Carlos, Brazil
Abstract :
In this work, we present results of the short-time dielectric breakdown test in high-density polyethylene (HDPE) containing 2.0 wt% of carbon black and 0.5 wt% of titanium dioxide mixed in different processing equipment, in a single screw extruder and in a co-rotational twin screw extruder. These additives are commonly used as pigments in polyolefin materials used as insulation in medium voltage cables. Thin film specimens were obtained by hot-compression, from materials compounded in these extruders. For the dielectric breakdown test, a DC voltage ramp rate of 500 V/sec. was applied to the samples which were immersed in a silicone oil bath at room temperature. The results were analyzed by the Weibull distribution. The Weibull shape and scale parameters were determined by Maximum Likelihood and Graphical Methods. The homogeneity of the pigments in the compounds was analyzed by optical microscopy. These results show that the breakdown strength depends on the mixing conditions. The best results were obtained in materials mixed in a twin screw extruder
Keywords :
Weibull distribution; electric breakdown; electric strength; insulation testing; maximum likelihood estimation; polyethylene insulation; power cable insulation; DC breakdown strength; DC voltage ramp rate; Weibull distribution; dielectric breakdown test; high density polyethylene compound; hot-compression; maximum likelihood method; medium voltage cables; mixing conditions; optical microscopy; pigment homogeneity; scale parameters; screw extruder; short-time dielectric breakdown test; silicone oil bath; Additives; Dielectric breakdown; Dielectric materials; Electric breakdown; Fasteners; Optical microscopy; Pigments; Polyethylene; Testing; Titanium;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-3851-0
DOI :
10.1109/CEIDP.1997.634586