DocumentCode :
2073773
Title :
Chip scale packaging of piezoresistive pressure sensors using dry-film shielding
Author :
Huang, Tyson ; Lung-Tai Chen ; Chu, Peter ; Chen, Y.S. ; Ho, C.W. ; Hsu, Chung-Yi ; Pan, Jason
Author_Institution :
Res. & Dev. Dept., IST
fYear :
2009
fDate :
26-29 May 2009
Firstpage :
1703
Lastpage :
1707
Abstract :
In this study, a chip scale packaging (CSP) of piezoresistive pressure sensors using a dry-film shielding approach is demonstrated. A sensing-channel just above the silicon membrane of the pressure sensor has to be reserved in the package body. To prevent the silicon membrane of the pressure sensors from the metal-deposition contaminations, a dry-film with a redistribution pattern is used to shield the sensing-channel opening during seed layer sputter process of the trace redistribution. Experimental results reveal that the silicon membrane of the pressure sensor is free of metal-deposition contamination and functional operation. The packaged pressure sensor has a linearity error of 0.2 psi at 25degC and sensitivity repeatability of 3.5times10-4mVV-1psi-1 at pressure range of 0~100psi (3sigma). The proposed pressure sensor package holds advantages on both low cost and tiny packaging size, making it suitable for portable consumer products.
Keywords :
chip scale packaging; membranes; piezoresistive devices; pressure sensors; silicon; sputtering; Si; chip scale packaging; dry-film shielding; metal-deposition contaminations; piezoresistive pressure sensors; seed layer sputter process; sensing-channel opening; silicon membrane; temperature 25 degC; trace redistribution; Biomembranes; Chip scale packaging; Costs; Electronics packaging; Linearity; Piezoresistance; Semiconductor device packaging; Sensor phenomena and characterization; Silicon; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2009.5074244
Filename :
5074244
Link To Document :
بازگشت