Concurrent planning and feasibility for efficient Package-on-Package (PoP) design

Volumetric packaging like PoP continues to deliver the functional density, weight, and configurability needed to keep pace with Moore´s Law for the foreseeable future. On the horizon, TSV packages promise even greater density and performance; however, lack of EDA tools is a limiting factor to their widespread adoption. Progressive EDA vendors recognize the multi-substrate, multi-domain nature of 3D packaging and view the status-quo of sequential design flows with separate tools and databases as a severely limiting factor. The new generation of planning and feasibility tools supports critical decision making on issues that impact performance, complexity, and cost at a point in the design process when it´s most economical to effect change.