Title :
Integrated materials enabling TSV/3D-TSV
Author :
Itabashi, Toshiaki
Author_Institution :
DuPont WLP Solutions, Kawasaki
Abstract :
There is a consistence flux of miniaturization, value added functionality to IC packaging/modules driven by significant increase of mobile/networking products in the consumer market. The advanced packaging technologies, particularly TSV/3D-TSV approach is driving innovative design and novel applications. This paper examines the challenges for TSV/3D packaging and in particular some material solutions for via creation, via cleaning, via fill, thinning and bonding for stack and assembly.
Keywords :
integrated circuit packaging; IC packaging; TSV/3D-TSV; integrated materials; mobile products; networking products; Assembly; Cleaning; Costs; Etching; Foot; Packaging; Plasma applications; Resists; Sulfur hexafluoride; Through-silicon vias;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074254
