• DocumentCode
    2074137
  • Title

    Repairing Incomplete Measured Data with Haptic Interaction

  • Author

    Cheng, Siyuan ; Liang, Siquan ; Zhang, Xiangwei

  • Author_Institution
    Fac. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • fYear
    2009
  • fDate
    17-19 Oct. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Measured data of a product can be incomplete because of the inaccessibility or invisibility of some portions of the product surface for measure tools in reverse engineering, which could makes it difficult for reverse engineering systems to create the CAD model from those measured data. In this paper, a novel incomplete data repair method based on haptic interaction is presented. Starting from the import of a dataset digitized from a physical object, various haptic sculpting tools are explored to repair the incomplete measured data, and the shape and size of these tools may be changed dynamically to satisfy specific situations, which forms a flexible and intuitive sculpting toolbox used to clean and repair the measured data. A high-quality STL file can be obtained from the system which is ideal for rapid prototyping. Case study is also given to demonstrate the feasibility of this new method, and finally a future direction of integration repairing measured data with designing innovative new object through haptic interaction in reverse engineering is proposed.
  • Keywords
    CAD; haptic interfaces; reverse engineering; software prototyping; CAD model; haptic interaction; haptic sculpting tools; incomplete data repair method; incomplete measured data; rapid prototyping; reverse engineering; Data engineering; Haptic interfaces; Imaging phantoms; Laser modes; Prototypes; Reverse engineering; Shape measurement; Size measurement; Solid modeling; Surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image and Signal Processing, 2009. CISP '09. 2nd International Congress on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4244-4129-7
  • Electronic_ISBN
    978-1-4244-4131-0
  • Type

    conf

  • DOI
    10.1109/CISP.2009.5301080
  • Filename
    5301080