• DocumentCode
    2074177
  • Title

    Evaluation of the asphalt pavement at low temperature using asphalt thermal stress program

  • Author

    Yongju, Li ; Yuqi, Huang ; Boyuan, Li ; Wenting, Dai

  • Author_Institution
    Coll. of Transp., Jilin Univ., Changchun, China
  • fYear
    2011
  • fDate
    16-18 Dec. 2011
  • Firstpage
    1313
  • Lastpage
    1316
  • Abstract
    Though most of cracks contribute to the temperature stress of surface course itself, temperature shrinkage action of semi-rigid base course can not be ignored. So this article researches several aspects as followed: Summarize the control method commonly used at home and abroad now. In comparison, the stiffness modulus of asphalt concrete determined is also the key factor to ascertain the temperature stress. And then integrates, at last uses the weighted average method to calculate the whole temperature stress of surface course. At the same time, program and use simple interface. Compare with the results of TSRST and bending destroy test, temperature stress gained highly agree with them. On the other side, compare with the investigate data of the crack ratio of several roads in Hei Long-jiang Province, it also get very consistent result. So it illustrate that the temperature stress gained by the procedure is close to the reality.
  • Keywords
    asphalt; bending strength; elastic moduli; road building; surface cracks; thermal stress cracking; Hei Long-jiang Province; TSRST; asphalt concrete; asphalt pavement; asphalt thermal stress program; bending destroy test; low temperature evaluation; semirigid base course; stiffness modulus; surface course stress; temperature shrinkage action; Asphalt; Educational institutions; Roads; Stress; Surface cracks; Thermal stresses; Asphalt pavement; low temperature evaluation index; stiffness modulus; temperature stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation, Mechanical, and Electrical Engineering (TMEE), 2011 International Conference on
  • Conference_Location
    Changchun
  • Print_ISBN
    978-1-4577-1700-0
  • Type

    conf

  • DOI
    10.1109/TMEE.2011.6199447
  • Filename
    6199447