DocumentCode
2074191
Title
Optical interconnection module integrated on a flexible optical/electrical hybrid printed circuit board
Author
Lee, Woo-Jin ; Hwang, Sung Hwan ; Lim, Jung Woon ; Cho, Che Hyun ; Kim, Gye Won ; Rho, Byung Sup
Author_Institution
Integrated Opt. Module Lab., Korea Photonics Technol. Inst., Gwangju
fYear
2009
fDate
26-29 May 2009
Firstpage
1802
Lastpage
1805
Abstract
An optical interconnection module directly integrated on a flexible optical/electrical hybrid printed circuit board (O/E hybrid PCB) is presented. A newly proposed polymeric optical waveguide plays roles in the optical path and in a platform as an O/E hybrid PCB integrated with various optical/electrical components. The fabricated flexible O/E hybrid PCB had sufficient optical characteristics such as a low bending loss and propagation loss and a low total transmission loss including waveguide loss and coupling losses of the module calculated to 15 dB. The suggested optical interconnection was also successfully demonstrated with a 5-Gb/s data transmission through the module.
Keywords
data communication; electro-optical devices; flexible electronics; integrated optoelectronics; light propagation; optical fabrication; optical interconnections; optical losses; optical polymers; optical transmitters; optical waveguides; printed circuits; bending loss; bit rate 5 Gbit/s; coupling loss; data transmission; flexible optical-electrical hybrid printed circuit board fabrication; loss 15 dB; optical interconnection module integration; optical transmitter; polymeric optical waveguide; propagation loss; total transmission loss; Flexible printed circuits; Integrated optics; Optical coupling; Optical devices; Optical interconnections; Optical losses; Optical polymers; Optical waveguide components; Optical waveguides; Propagation losses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074262
Filename
5074262
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