DocumentCode :
2074246
Title :
Sacrificial removal of caps of aligned carbon nanotubes for interconnect application
Author :
Xiao, Zhiyong ; Chai, Yang ; Chan, Philip C.H. ; Chen, Baoqin ; Zhao, Min ; Liu, Ming
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
fYear :
2009
fDate :
26-29 May 2009
Firstpage :
1811
Lastpage :
1815
Abstract :
Single-walled (SW) and multi-walled (MW) carbon nanotubes (CNTs) have excellent electrical, mechanical and thermal properties. They are considered as promising materials for future interconnect applications. MWCNTs are concentric rolls of graphene sheets. As-grown MWCNTs are typically close-ended, so the inner shells cannot be contacted to the metal electrodes and have limited contribution to the electrical conductance. Open-ended MWCNTs are preferred for interconnect applications to meet the conductance requirement. In this paper, a simple sacrificial process was developed to truncate CNTs. CNT vias were fabricated and a sacrificial process was employed to remove the CNT caps. Resistance of vias with open-ended and close-ended MWCNTs was measured using two-terminal voltage-current measurement. Via conductance was significantly increased after the MWCNTs in the vias were truncated to be open-ended using the sacrificial process.
Keywords :
carbon nanotubes; electrical conductivity; electrochemical electrodes; C; CNT vias; aligned carbon nanotubes; electrical conductance; graphene sheets; interconnect application; metal electrodes; two-terminal voltage-current measurement; Carbon nanotubes; Conducting materials; Contacts; Copper; Dielectric substrates; Electrical resistance measurement; Electrodes; Fabrication; Iron; Lithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2009.5074264
Filename :
5074264
Link To Document :
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