• DocumentCode
    2074306
  • Title

    Challenges in integration of diverse functionalities on CMOS

  • Author

    Masu, Kazuya ; Ishihara, Noboru ; Konishi, Tsuyoshi ; Machida, Kenji ; Toshiyoshi, Hiroshi

  • Author_Institution
    Solutions Res. Lab., Tokyo Inst. of Technol., Yokohama, Japan
  • fYear
    2013
  • fDate
    22-25 Jan. 2013
  • Firstpage
    390
  • Lastpage
    393
  • Abstract
    We introduce “Wafer Shuttle” that is suitable for integration of diverse functionalities. CMOS/MEMS design flow and environment based on SPICE is discussed. It is pointed out that modeling will be important to promote the R&D of MEMS/CMOS and/or diverse-functionalities integration on CMOS.
  • Keywords
    CMOS integrated circuits; SPICE; micromechanical devices; research and development; CMOS design flow; MEMS design flow; R&D; SPICE; diverse functionality integration; wafer shuttle; CMOS integrated circuits; Integrated circuit modeling; Mathematical model; Micromechanical devices; SPICE; Semiconductor device modeling; Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4673-3029-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2013.6509627
  • Filename
    6509627
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2074306