Title :
3DIC from concept to reality
Author :
Lee, Fred ; Shen, Ben ; Chen, Weijie ; Suk Lee
Author_Institution :
TSMC Design & Technol. Platform, Taiwan
Abstract :
3DIC technology presents a new system integration strategy for the electronics industry to achieve superior system performance with lower power consumption, higher bandwidth, smaller system form factor, and shorter time to market through heterogeneous integration. TSMC´s “Chip-on-Wafer-on-Substrate (CoWoS)” technology opens up a new opportunity to bring 3D chip stacking vision from concept to reality. The provided methodology will be discussed about this market trend and the different pieces needed to jointly make it a success, which includes customers´ required application, TSMC´s support design flow, as well as the ecosystem design enablement of multi-die implementation, DFT solution, thermal analysis, verification and new categories of IPs.
Keywords :
design for testability; integrated circuit design; thermal analysis; three-dimensional integrated circuits; 3D chip stacking vision; 3DIC technology; DFT solution; TSMC chip-on-wafer-on-substrate technology; design flow; ecosystem design enablement; electronics industry; heterogeneous integration; market trend; multidie implementation; power consumption; system form factor; system integration strategy; system performance; thermal analysis; IP networks; Inductance; Random access memory; Thermal analysis; Three-dimensional displays; Through-silicon vias;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509628
