• DocumentCode
    2074328
  • Title

    45 Degree polymer micro-mirror integration for board-level three-dimensional optical interconnects

  • Author

    Wang, Fengtao ; Liu, Fuhan ; Adibi, Ali

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1842
  • Lastpage
    1845
  • Abstract
    We introduced here a novel method to fabricate polymer optical waveguides with integrated 45deg total internal reflection (TIR) micro-mirrors by contact photolithography on printed circuit boards (PCBs) to achieve fully embedded optical interconnects. The 45deg TIR mirrors were shaped at the ends of the waveguides in one step to provide surface normal light coupling between waveguides and optoelectronic devices. A tank of de-ionized (D.I.) water is used to couple the ultraviolet (UV) exposure beam through the core polymer layer at 45deg angle during the contact photolithography process, and then the 45 mirror facet will be formed after the post-process. Compared to the conventional glass prism-polymer coupling interface, this novel water-polymer interface provides a simple, convenient, and cost efficient solution. This technique is not only compatible with PCB manufacturing facility and technology, but also suitable to large panel board-level manufacturing for optical interconnects. The 45deg angle can be controlled with an accuracy of plusmn1deg and has a high reproducibility. The average insertion loss of the 45deg TIR uncoated mirrors is around 1.6 dB.
  • Keywords
    integrated optoelectronics; micromirrors; optical fabrication; optical interconnections; optical losses; optical polymers; optical waveguides; photolithography; printed circuit manufacture; production facilities; PCB manufacturing facility; board-level 3D optical interconnect; light coupling; loss 1.6 dB; optoelectronic device; panel board-level manufacturing; photolithography; polymer micromirror integration; polymer optical waveguide fabrication; printed circuit board; total internal reflection; ultraviolet exposure beam; water-polymer interface; Coupling circuits; Integrated optics; Lithography; Mirrors; Optical coupling; Optical interconnections; Optical polymers; Optical reflection; Optical waveguides; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074269
  • Filename
    5074269