Title :
High temperature deformation of area array packages by moire interferometry/FEM hybrid method
Author :
Zhu, Jiansen ; Zou, Daqing ; Liu, Sheng
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
In this study, moire interferometry and experimental/FEM hybrid method were applied in the thermal deformation analysis of several area array packages. High frequency gratings of 1200 l/mm and 600 l/mm were replicated onto the cross sections of packages at the elevated temperature of 80°C or 160°C. These packages include an OMPAC BGA and a flip-chip BGA. The thermal deformation of these packages were measured by moire interferometry. Warpage of the packaging systems was measured and the effects of the bonding, encapsulation, soldering, and geometry on the deformation were discussed. The strain distributions inside the solder joints were analyzed by both moire interferometry and experimental/FEM hybrid method
Keywords :
deformation; encapsulation; finite element analysis; flip-chip devices; integrated circuit packaging; light interferometry; moire fringes; soldering; 160 C; 80 C; OMPAC BGA; area array packages; flip-chip BGA; high temperature deformation; moire interferometry/FEM hybrid method; solder joints; strain distributions; thermal deformation analysis; warpage; Bonding; Capacitive sensors; Encapsulation; Frequency; Geometry; Gratings; Interferometry; Packaging; Soldering; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606208
