DocumentCode
2075213
Title
DARNS:A randomized multi-modulo RNS architecture for double-and-add in ECC to prevent power analysis side channel attacks
Author
Ambrose, Jude Angelo ; Pettenghi, H. ; Sousa, Leonel
Author_Institution
Sch. of Comput. Sci. & Eng., Univ. of New South Wales, Sydney, NSW, Australia
fYear
2013
fDate
22-25 Jan. 2013
Firstpage
620
Lastpage
625
Abstract
Security in embedded systems is of critical importance since most of our secure transactions are currently made via credit cards or mobile phones. Power analysis based side channel attacks have been proved as the most successful attacks on embedded systems to retrieve secret keys, allowing impersonation and theft. State-of-the-art solutions for such attacks in Elliptic Curve Cryptography (ECC), mostly in software, hinder performance and repeatedly attacked using improved techniques. To protect the ECC from both simple power analysis and differential power analysis, as a hardware solution, we propose to take advantage of the inherent parallelization capability in Multi-modulo Residue Number Systems (RNS) architectures to obfuscate the secure information. Random selection of moduli is proposed to randomly choose the moduli sets for each key bit operation. This solution allows us to prevent power analysis, while still providing all the benefits of RNS. In this paper, we show that Differential Power Analysis is thwarted, as well as correlation analysis.
Keywords
embedded systems; public key cryptography; residue number systems; DARNS; correlation analysis; credit cards; differential power analysis; double-and-add in ECC; elliptic curve cryptography; embedded systems; mobile phones; moduli random selection; multimodulo residue number systems; power analysis side channel attacks; randomized multimodulo RNS architecture; secret keys; Adders; Algorithm design and analysis; Bismuth; Computer architecture; Elliptic curve cryptography; Software; Software algorithms;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location
Yokohama
ISSN
2153-6961
Print_ISBN
978-1-4673-3029-9
Type
conf
DOI
10.1109/ASPDAC.2013.6509667
Filename
6509667
Link To Document