Title :
Low Diameter Unicast On-Chip Interconnection Networks for Many-Core Embedded Systems
Author_Institution :
Coll. of IT, UAE Univ., Al Ain, United Arab Emirates
Abstract :
It is critical for the network-on-chip in embedded multi-core and many-core chips to be scalable while limiting power consumption. With the router power dominating the network´s power, one way to achieve this goal is by the design of on-chip interconnection networks with small diameters and simple routing. Herein, we present a few new unicast on-chip networks for interconnecting the cores with diameters superior to the popular 2D mesh.
Keywords :
embedded systems; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; embedded systems; many-core chips; multicore chips; network-on-chip; on-chip interconnection networks; router power; unicast on-chip networks; Broadcasting; Delay; Embedded system; Energy consumption; Multiprocessor interconnection networks; Network-on-a-chip; Power system interconnection; System-on-a-chip; Unicast; Yarn; On-chip interconnection networks; many core embedded systems; network diameter;
Conference_Titel :
Complex, Intelligent and Software Intensive Systems (CISIS), 2010 International Conference on
Conference_Location :
Krakow
Print_ISBN :
978-1-4244-5917-9
DOI :
10.1109/CISIS.2010.15
