A unique application of decapsulation combining laser and plasma

Author

Thomas, Jason ; Baer, Jacob ; Westby, Philip ; Mattson, Kevin ; Haring, Frederik ; Strommen, Greg ; Jacobson, John ; Ahmad, Sabarinah Sh ; Reinholz, Aaron

Author_Institution

Center for Nanoscale Sci. & Eng., North Dakota State Univ., Fargo, ND

fYear

2009

fDate

26-29 May 2009

Firstpage

2011

Lastpage

2015

Abstract

Often the greatest cost for developing a new package or system is the acquisition of bare chips. To meet this challenge, a unique technique involving laser and plasma has been developed for extracting dice or chips for reuse and repackaging. Epoxy molded integrated circuit (IC) packages are decapsulated using a combination of a neodymium-doped yttrium aluminum garnet (YAG) laser and reactive ion etch (RIE) plasma etcher. Using the parameters mentioned in this paper, a yield of over 70% of functional packages was achieved at the end of decapsulation.

Keywords

electronics packaging; failure analysis; laser beam applications; sputter etching; YAG laser; decapsulation; epoxy molded integrated circuit packages; reactive ion etch plasma etcher; Chemical lasers; Etching; Gas lasers; Integrated circuit packaging; Laser ablation; Laser theory; Optical materials; Plasma applications; Power lasers; Surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2009.5074298

Filename

5074298