Title :
MCM-C/D design for the CMOS implementation of the S/390 system
Author :
Katopis, G. ; Becker, D. ; Smith, H. ; Stoller, H.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
The new Enterprise model for the S/390 system achieves an off chip bus speed of 167 MHz using as a first level package on an alumina based multichip substrate (MCM) with thin film redistribution. A description of the physical attributes of this substrate will be presented in this paper. The electrical considerations used for the design of this MCM are described with emphasis on the techniques used for the noise containment
Keywords :
CMOS digital integrated circuits; integrated circuit design; integrated circuit packaging; multichip modules; network routing; Al2O3; Al2O3 based multichip substrate; CMOS implementation; Enterprise model; MCM-C/D design; S/390 system; electrical considerations; first level package; noise containment; off chip bus speed; thin film redistribution; wiring strategies; Birth disorders; CMOS technology; Costs; Energy consumption; Frequency; Microprocessor chips; Packaging machines; SRAM chips; Substrates; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606212
