• DocumentCode
    2075583
  • Title

    Investigation of 2D transition metal dichalcogenide films for electronic devices

  • Author

    Duesberg, Georg S. ; Hallam, Toby ; O´Brien, Maria ; Gatensby, Riley ; Hye-Young Kim ; Kangho Lee ; Berner, Nina C. ; McEvoy, Niall ; Chanyoung Yim

  • Author_Institution
    Sch. of Chem., Trinity Coll. Dublin, Dublin, Ireland
  • fYear
    2015
  • fDate
    26-28 Jan. 2015
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    The reduction of dimensionality has revealed exciting properties in layered 2D materials such as graphene and transition metal dichalcogenides (TMDs). In order to use these materials in functional devices, processes for reliable large scale synthesis, functionalization and integration must be developed. Here we present the thermally assisted conversion of various TMD layers. The sulfides and selenides of Mo and W have been produced on silicon chips. These films have been characterized thoroughly and electrically addressed. Furthermore, we report on CVD growth of MoS2 and WS2 monolayers in a microreactor setup. Besides transistor applications, TMDs can be used for other electronic applications such as chemical sensors and photodiodes. Integrating novel 2D materials with silicon technology may lead to significant advances toward a wide range of novel devices.
  • Keywords
    chemical vapour deposition; field effect transistors; microreactors; molybdenum compounds; monolayers; semiconductor device reliability; silicon; tungsten compounds; 2D material layer; 2D transition metal dichalcogenide films; CVD growth; MoS2; Si; TMD layers; WS2; chemical sensors; chemical vapour deposition; dimensionality reduction; electronic device application; field effect transistors; functional devices; functionalization reliability; graphene; integration reliability; large scale synthesis reliability; microreactor set-up; monolayers; photodiodes; thermally assisted conversion; transistor applications; Metals; Optical films; Optical filters; Optical imaging; Substrates; 2D Materials; CVD; Hybrid devices; Transition metal dichalcogenides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultimate Integration on Silicon (EUROSOI-ULIS), 2015 Joint International EUROSOI Workshop and International Conference on
  • Conference_Location
    Bologna
  • Type

    conf

  • DOI
    10.1109/ULIS.2015.7063776
  • Filename
    7063776