DocumentCode
2075583
Title
Investigation of 2D transition metal dichalcogenide films for electronic devices
Author
Duesberg, Georg S. ; Hallam, Toby ; O´Brien, Maria ; Gatensby, Riley ; Hye-Young Kim ; Kangho Lee ; Berner, Nina C. ; McEvoy, Niall ; Chanyoung Yim
Author_Institution
Sch. of Chem., Trinity Coll. Dublin, Dublin, Ireland
fYear
2015
fDate
26-28 Jan. 2015
Firstpage
73
Lastpage
76
Abstract
The reduction of dimensionality has revealed exciting properties in layered 2D materials such as graphene and transition metal dichalcogenides (TMDs). In order to use these materials in functional devices, processes for reliable large scale synthesis, functionalization and integration must be developed. Here we present the thermally assisted conversion of various TMD layers. The sulfides and selenides of Mo and W have been produced on silicon chips. These films have been characterized thoroughly and electrically addressed. Furthermore, we report on CVD growth of MoS2 and WS2 monolayers in a microreactor setup. Besides transistor applications, TMDs can be used for other electronic applications such as chemical sensors and photodiodes. Integrating novel 2D materials with silicon technology may lead to significant advances toward a wide range of novel devices.
Keywords
chemical vapour deposition; field effect transistors; microreactors; molybdenum compounds; monolayers; semiconductor device reliability; silicon; tungsten compounds; 2D material layer; 2D transition metal dichalcogenide films; CVD growth; MoS2; Si; TMD layers; WS2; chemical sensors; chemical vapour deposition; dimensionality reduction; electronic device application; field effect transistors; functional devices; functionalization reliability; graphene; integration reliability; large scale synthesis reliability; microreactor set-up; monolayers; photodiodes; thermally assisted conversion; transistor applications; Metals; Optical films; Optical filters; Optical imaging; Substrates; 2D Materials; CVD; Hybrid devices; Transition metal dichalcogenides;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultimate Integration on Silicon (EUROSOI-ULIS), 2015 Joint International EUROSOI Workshop and International Conference on
Conference_Location
Bologna
Type
conf
DOI
10.1109/ULIS.2015.7063776
Filename
7063776
Link To Document