Title :
Research on a method to derive an ideal 3DSiP
Author :
Taya, Atsushi ; Iwata, Yoshiharu ; Satoh, Ryohei ; Murata, Hidenori ; Morinaga, Eiji ; Kudo, Keiji ; Okamoto, Kazuya
Author_Institution :
Grad. Sch. of Eng., Osaka Univ., Suita
Abstract :
In this paper we construct a system design method for 3D integration. We report the use of this method to predict suitable 3D-SiP structures. 3D integration design is expected to be the breakthrough needed to overcome the apparent limits on design rule scaling in regimes where previous design methods have become difficult to implement. Given this current situation, we propose a method that assists in the design of large scale/complex systems that are representative of LSI systems. We use this method to predict suitable 3DSiP structures in the rough design phase.
Keywords :
integrated circuit design; large scale integration; system-in-package; 3DSiP structure; LSI system; complex system; rough design phase; system design method; Appropriate technology; Central Processing Unit; Circuits; Cities and towns; Data communication; Design methodology; Energy consumption; Large scale integration; Space technology; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074310
