• DocumentCode
    2075837
  • Title

    Low-power 3D integrated ferromagnetic computing

  • Author

    Becherer, M. ; Breitkreutz, S. ; Eichwald, I. ; Ziemys, G. ; Kiermaier, J. ; Csaba, G. ; Schmitt-Landsiedel, D.

  • Author_Institution
    Lehrstuhl fur Tech. Elektron., Tech. Univ. Munchen, München, Germany
  • fYear
    2015
  • fDate
    26-28 Jan. 2015
  • Firstpage
    121
  • Lastpage
    124
  • Abstract
    As CMOS scaling becomes more and more challenging there is strong impetus for beyond CMOS device research to add new functionality to ICs. In this article, a promising technology with non-volatile ferromagnetic computing states - the so-called perpendicular Nanomagnetic Logic (pNML) - is reviewed. After introducing the 2D planar implementation of NML with magnetization perpendicular to the surface, the path to monolithically 3D integrated systems is discussed. Instead of CMOS substitution, additional functionality is added by a coprocessor architecture as a prospective back-end-of-line (BEOL) process. The unconventional computation in the ferromagnetic domain can lead to highly dense computing structures without leakage currents, atto-joule dissipation per bit operation and data-throughputs comparable to state-of-the-art high-performance CMOS CPUs.
  • Keywords
    CMOS integrated circuits; coprocessors; logic circuits; nanomagnetics; three-dimensional integrated circuits; 2D planar implementation; BEOL process; CMOS device research; CMOS scaling; atto-joule dissipation; back-end-of-line process; coprocessor architecture; data-throughputs; ferromagnetic domain; high-performance CMOS CPU; highly-dense computing structures; low-power 3D integrated ferromagnetic computing; monolithic 3D integrated systems; nonvolatile ferromagnetic computing states; pNML; perpendicular nanomagnetic logic; Logic gates; Magnetic domain walls; Magnetic domains; Magnetic hysteresis; Perpendicular magnetic anisotropy; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultimate Integration on Silicon (EUROSOI-ULIS), 2015 Joint International EUROSOI Workshop and International Conference on
  • Conference_Location
    Bologna
  • Type

    conf

  • DOI
    10.1109/ULIS.2015.7063788
  • Filename
    7063788