Title :
Optimal body bias selection for leakage improvement and process compensation over different technology generations
Author :
Neau, Cassondra ; Roy, Kaushik
Author_Institution :
Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
We present techniques to determine the optimal body bias (forward or reverse) to minimize leakage current and compensate process variations in scaled CMOS technologies. A circuit trades off sub-threshold leakage with band-to-band tunneling leakage at the source/drain junctions to determine the optimal substrate bias for different technology generations and under process variations. Using optimal body bias results in 43% and 42% savings in leakage for predictive 70 nm and 50 nm NMOS devices, respectively. This technique also reduces the effects of die-to-die and intra-die process variations in transistor length and supply voltage by 43% and 60%, respectively, in 50 nm NMOS devices, resulting in improved yield.
Keywords :
CMOS integrated circuits; compensation; integrated circuit design; integrated circuit modelling; integrated circuit yield; leakage currents; nanoelectronics; tunnelling; 50 nm; 70 nm; CMOS yield; NMOS devices; band-to-band tunneling leakage; die-to-die process variations; intra-die process variations; leakage current; leakage improvement; optimal body bias selection; optimal substrate bias; process compensation; process variations; scaled CMOS technologies; source/drain junctions; sub-threshold leakage; supply voltage; technology generations; transistor length; Algorithm design and analysis; CMOS process; CMOS technology; Integrated circuit yield; Leakage current; MOS devices; Permission; Threshold voltage; Tunneling; Very large scale integration;
Conference_Titel :
Low Power Electronics and Design, 2003. ISLPED '03. Proceedings of the 2003 International Symposium on
Print_ISBN :
1-58113-682-X
DOI :
10.1109/LPE.2003.1231846