Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

Author

Lee, S. W Ricky ; Tong, Y.W. ; Chan, Y.S. ; Lo, J.C.C. ; Zhang, R.

Author_Institution

Electron. Packaging Lab., Hong Kong Univ. of Sci. & Technol., Hong Kong

fYear

2009

fDate

26-29 May 2009

Firstpage

2137

Lastpage

2142

Abstract

The objective of the present study is to develop a robust high-throughput assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype with the proposed process has been developed. A sample strip of packaged LED array has been produced as well to validate the developed assembly process.

Keywords

flexible electronics; flip-chip devices; light emitting diodes; lighting; prototypes; LED arrays; encapsulation; flexible printed circuit substrate; flexible printed circuit tape; flip chip assembly; general solid state lighting; light emitting diode; process development; prototyping; reel-to-reel assembly process; wide area general lighting; yellow phosphor coating; Assembly; Flexible printed circuits; Flip chip; LED lamps; Light emitting diodes; Optical arrays; Phosphors; Prototypes; Robustness; Solid state lighting;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2009.5074321

Filename

5074321