Effect Study of Chip Offset on the Optical Performance of Light-Emitting Diode Packaging

Author

Qi Chen ; Run Hu ; Bin Xie ; Xiaobing Luo

Author_Institution

Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

Volume

27

Issue

12

fYear

2015

fDate

June15, 15 2015

Firstpage

1337

Lastpage

1340

Abstract

In this letter, we studied the effect of chip offset on the optical performance of bare chip and white light-emitting diode (LED) package through a series of comparative experiments. LED modules with different chip offset distances were packaged and measured. The results show that chip position offset has a great influence on white LED´s performance. When the offset distance reaches 1 mm, the luminous efficiency decreases by 22.9% and the angular color distribution is deteriorated. Two methods are recommended to avoid this effect.

Keywords

chip scale packaging; integrated optoelectronics; light emitting diodes; LED modules; angular color distribution; chip position offset; luminous efficiency; offset distance; optical performance; white LED; white light-emitting diode packaging; Coatings; Color; Integrated optics; Light emitting diodes; Optical imaging; Phosphors; Semiconductor device measurement; Light-emitting diode (LED); angular color distribution (ACD); chip offset; luminous efficiency;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2015.2421345

Filename

7083749