Effect Study of Chip Offset on the Optical Performance of Light-Emitting Diode Packaging

In this letter, we studied the effect of chip offset on the optical performance of bare chip and white light-emitting diode (LED) package through a series of comparative experiments. LED modules with different chip offset distances were packaged and measured. The results show that chip position offset has a great influence on white LED´s performance. When the offset distance reaches 1 mm, the luminous efficiency decreases by 22.9% and the angular color distribution is deteriorated. Two methods are recommended to avoid this effect.