DocumentCode
2076544
Title
A flexible hierarchical 3-D module assembler
Author
Dutta, Robi ; Marks, Maurice ; Morrissey, Craig ; Rao, Ravi ; Sapiro, Lee
Author_Institution
Digital Equipment Corp., Hudson, MA, USA
fYear
1990
fDate
12-15 Mar 1990
Firstpage
124
Lastpage
128
Abstract
A module assembler based on a design philosophy that is different from work reported in the literature is presented. Most assemblers are targeted for a `correct by construction´ approach. However, the design philosophy in a mostly handcrafted high performance, high density chip is that of `correct by verification´. The authors´ module assembler is designed with a view to supporting highly flexible layout requirements (e.g. non-slicing, 3-d) and the ability to `assemble´ a netlist for comparison with the netlist extracted from the polygon level layout
Keywords
circuit layout CAD; correct by verification; design philosophy; flexible hierarchical 3-D module assembler; highly flexible layout requirements; polygon level layout; Application specific integrated circuits; Assembly systems; Buildings; Libraries; Modular construction; Runtime; Tiles; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1990., EDAC. Proceedings of the European
Conference_Location
Glasgow
Print_ISBN
0-8186-2024-2
Type
conf
DOI
10.1109/EDAC.1990.136632
Filename
136632
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