• DocumentCode
    2076544
  • Title

    A flexible hierarchical 3-D module assembler

  • Author

    Dutta, Robi ; Marks, Maurice ; Morrissey, Craig ; Rao, Ravi ; Sapiro, Lee

  • Author_Institution
    Digital Equipment Corp., Hudson, MA, USA
  • fYear
    1990
  • fDate
    12-15 Mar 1990
  • Firstpage
    124
  • Lastpage
    128
  • Abstract
    A module assembler based on a design philosophy that is different from work reported in the literature is presented. Most assemblers are targeted for a `correct by construction´ approach. However, the design philosophy in a mostly handcrafted high performance, high density chip is that of `correct by verification´. The authors´ module assembler is designed with a view to supporting highly flexible layout requirements (e.g. non-slicing, 3-d) and the ability to `assemble´ a netlist for comparison with the netlist extracted from the polygon level layout
  • Keywords
    circuit layout CAD; correct by verification; design philosophy; flexible hierarchical 3-D module assembler; highly flexible layout requirements; polygon level layout; Application specific integrated circuits; Assembly systems; Buildings; Libraries; Modular construction; Runtime; Tiles; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1990., EDAC. Proceedings of the European
  • Conference_Location
    Glasgow
  • Print_ISBN
    0-8186-2024-2
  • Type

    conf

  • DOI
    10.1109/EDAC.1990.136632
  • Filename
    136632