A novel die bonding adhesive-silver filled film

Silver paste is the die bonding adhesive most widely used to attach semiconductor silicon chips to metal lead frames in plastic packages. However the increased integration of semiconductor devices and size-expansion of chips has led to the emergence a number of problems with the current adhesives, one of which is insufficient resistance to package cracking during reflow soldering. We have developed therefore a die bonding adhesive film to address these issues. Study of relations between adhesive film composition and those properties resulted in the composition featuring high peel strength and low moisture absorption. A novel die bonding adhesive-silver filled film DF-335-was capable of attaching at low temperature, low pressure and short time. This film showed excellent resistance to package cracking during reflow soldering