Moisture and thermal degradation of cyanate-ester-based die attach material

Author

Gonzales, John Ivan J ; Mena, Manolo G.

Author_Institution

Analog Devices Phils. Inc., Manila, Philippines

fYear

1997

fDate

18-21 May 1997

Firstpage

525

Lastpage

535

Abstract

Cyanate-ester-based thermosetting die attach materials, commonly known as Low Temperature Die Attach (LTDA) are the newest innovation in Hermetic Die Attach Technology due to their improved manufacturability, high decomposition temperature and a moisture gettering effect. Although their dispensability and decomposition temperatures are well documented, little information is available on the effects of prolonged exposure to moisture and thermal conditions. A study was therefore conducted to investigate the behaviour of LTDA under thermal and moisture conditioning

Keywords

adhesion; getters; integrated circuit packaging; microassembling; moisture; seals (stoppers); conditioning; cyanate-ester-based materials; decomposition temperature; dispensability; hermetic die attach technology; low temperature die attach; manufacturability; moisture degradation; moisture gettering effect; thermal degradation; thermosetting die attach materials; Electronic packaging thermal management; Glass; Mechanical factors; Microassembly; Moisture; Polymers; Technological innovation; Temperature; Thermal degradation; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606219

Filename

606219