Title :
Moisture and thermal degradation of cyanate-ester-based die attach material
Author :
Gonzales, John Ivan J ; Mena, Manolo G.
Author_Institution :
Analog Devices Phils. Inc., Manila, Philippines
Abstract :
Cyanate-ester-based thermosetting die attach materials, commonly known as Low Temperature Die Attach (LTDA) are the newest innovation in Hermetic Die Attach Technology due to their improved manufacturability, high decomposition temperature and a moisture gettering effect. Although their dispensability and decomposition temperatures are well documented, little information is available on the effects of prolonged exposure to moisture and thermal conditions. A study was therefore conducted to investigate the behaviour of LTDA under thermal and moisture conditioning
Keywords :
adhesion; getters; integrated circuit packaging; microassembling; moisture; seals (stoppers); conditioning; cyanate-ester-based materials; decomposition temperature; dispensability; hermetic die attach technology; low temperature die attach; manufacturability; moisture degradation; moisture gettering effect; thermal degradation; thermosetting die attach materials; Electronic packaging thermal management; Glass; Mechanical factors; Microassembly; Moisture; Polymers; Technological innovation; Temperature; Thermal degradation; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606219
