DocumentCode
2077652
Title
Advances in manufacturing of helix traveling wave tubes
Author
Stolz, R. ; Gannon, B. ; Smith, C. ; Kottman, C.
fYear
2000
fDate
2-4 May 2000
Abstract
Summary form only given. Even though the advanced helix traveling wave tube (TWT) used in the microwave power module (MPM) enables, to a large extent, the compact size and high performance of the MPM, it currently represents greater than 40% of the cost. Unlike solid state devices, which are manufactured using highly automated methods, TWTs are fabricated using more traditional methods that often rely on highly skilled laborers. Phase II of a Navy ManTech program is underway at Northrop Grumman to apply lean manufacturing methodologies to the production of helix TWTs with a targeted cost reduction of 30-40%. The initial stages of this program involved baseline assessment, followed by a phase of opportunity assessment. Specific areas for manufacturability enhancement that are addressed include subassembly design, subassembly processing, fixturing, and automated measurement and test. These enhancements are aimed toward increased commonality, simplified assembly and processing, rapid verification, and increased yield. Implementation of "Lean manufacturing" principals using value streaming techniques were investigated and implemented. A commodity design team involving suppliers early in the design phase was formed which led to a supplier conference. Some goals of the supplier conference were to form teaming agreements with our supplier partners, long term forecasting of projected production volumes and creating unique solutions to lowering supplier/customer cycle times and costs.
Keywords
assembling; electron tube manufacture; microwave tubes; production testing; travelling wave tubes; Navy ManTech program; Northrop Grumman; automated measurement; automated testing; commodity design team; compact size; cost reduction; fixturing; helix TWT manufacture; helix traveling wave tubes; lean manufacturing methodologies; manufacturability enhancement; microwave power module; opportunity assessment; production; subassembly design; subassembly processing; value streaming techniques; Area measurement; Costs; Fixtures; Lean production; Manufacturing automation; Manufacturing processes; Microwave devices; Multichip modules; Process design; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference, 2000. Abstracts. International
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-5987-9
Type
conf
DOI
10.1109/OVE:EC.2000.847568
Filename
847568
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