Title :
Global education for packaging engineers: beyond science and technology
Author :
Higgins, Richard J.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The National Science Foundation has agreed to fund a 3-year (1995-98) pilot program called Global Innovation for Engineers (GIE), and has chosen to steer the funding through Georgia Tech´s Packaging Research Center (PRC), in order to enhance the PRC´s educational programs and to provide to GIE a built-in set of member companies. We have marketed the GIE program to the top global leaders in electronics, computers, and communications, both US based and also some non-US companies with a strong US presence who know they need to hire more global American engineers. This paper outlines the program´s early results and identifies the strategies that seem to be working as well as some that are not
Keywords :
electronic engineering education; packaging; Global Innovation for Engineers; National Science Foundation; Packaging Research Center; United States; electronics companies; global education; packaging engineers; Companies; Consumer electronics; Cost function; Design engineering; Educational programs; Educational technology; Electronics packaging; Engineering students; Innovation management; Technological innovation;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606225
