DocumentCode :
2079824
Title :
Electronic packaging and reliability education for the 21st century: the University of Maryland CALCE EPRC Program
Author :
Joshi, U. ; Pecht, M. ; Nakayama, W.
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fYear :
1997
fDate :
18-21 May 1997
Firstpage :
585
Lastpage :
588
Abstract :
In the 1980´s, University of Maryland faculty began teaching courses on electronic packaging and wrote the first book on this topic. As a result of two subsequent ε grants under the U.S. Government Technology Re-investment Program, the Computer-Aided Life-Cycle Engineering (CALCE) Electronic Packaging Research Center (EPRC), an academic center of the University of Maryland, today provides a cross-disciplinary undergraduate and graduate curriculum on Electronic Packaging and Reliability (EPAR). Offered through the Mechanical Engineering Department, students from all engineering disciplines including Electrical Engineering, Materials Science and Reliability Engineering enroll in the program. The success of the EPAR graduate program is evidenced by the respect it has gained from the electronics industry. All graduates of this program have been keenly sought after, and have enjoyed excellent job opportunities. In the era of dwindling enrollments in many graduate engineering programs, the EPAR program has seen a consistent growth. The instructional methodologies employed in this curriculum development effort are described and can serve as models for other multi-disciplinary programs
Keywords :
electronic engineering education; packaging; reliability; CALCE EPRC program; Computer-Aided Life-Cycle Engineering; EPAR; Electronic Packaging Research Center; Electronic Packaging and Reliability; University of Maryland; curriculum development; education; electronic packaging; graduate engineering; multi-disciplinary program; reliability; Books; Computer science education; Curriculum development; Educational programs; Electronics industry; Electronics packaging; Government; Materials science and technology; Mechanical engineering; Reliability engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-3857-X
Type :
conf
DOI :
10.1109/ECTC.1997.606229
Filename :
606229
Link To Document :
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