• DocumentCode
    2079891
  • Title

    Optimal memory controller placement for chip multiprocessor

  • Author

    Xu, Thomas Canhao ; Liljeberg, Pasi ; Tenhunen, Hannu

  • Author_Institution
    Turku Center for Comput. Sci. (TUCS), Turku, Finland
  • fYear
    2011
  • fDate
    9-14 Oct. 2011
  • Firstpage
    217
  • Lastpage
    226
  • Abstract
    In this paper, we analyze and compare different placements of memory controllers for Chip Multiprocessors (CMPs). As the number of cores increases, Network-on-Chip (NoC) based architectures are proposed as a promising interconnect technique for CMP. The memory bandwidth between on-chip components and off-chip memory has become a critical problem. The integration of more memory controllers on chip is one feasible way to solve this problem. However, the physical location of memory controllers in a mesh-based NoC have a significant impact on system performance. We investigate the placement of multiple memory controllers in an 8×8 NoC. Several metrics have been analyzed. An optimal memory controller placement is found and evaluated. We propose a generic "divide and conquer" method for solving the placement of memory controllers in large NoCs. By using applications selected from SPLASH-2, PARSEC, TPC and SPEC as benchmarks, it is shown that the average network latency, average link utilization and performance power product in our optimal placement are reduced by 7.63%, 10.44% and 13.94% compared with the conventional two-sides placement, respectively. This paper gives a solid theoretical foundation to future CMP design.
  • Keywords
    microprocessor chips; network-on-chip; PARSEC; SPEC; SPLASH-2; TPC; chip multiprocessor; link utilization; mesh based NoC; network latency; network-on-chip based architectures; optimal memory controller placement; performance power product; Aerospace electronics; Bandwidth; Diamond-like carbon; Memory management; Multicore processing; Process control; System-on-a-chip; Divide and conquer; Memory controller; Multicore; Resource placement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Hardware/Software Codesign and System Synthesis (CODES+ISSS), 2011 Proceedings of the 9th International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4503-0715-4
  • Type

    conf

  • Filename
    6062292