DocumentCode :
2080564
Title :
Performance and packaging implications of a MEMS based optical modulator for WDM fiber-to-the home systems
Author :
Walker, J.A. ; Ford, J.E. ; Basavanhally, N.
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
fYear :
1997
fDate :
18-21 May 1997
Firstpage :
601
Lastpage :
606
Abstract :
Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute
Keywords :
micromechanical devices; optical communication equipment; optical fibre subscriber loops; optical modulation; packaging; silicon; wavelength division multiplexing; 3.5 Mbit/s; MARS technology; MEMS based optical modulator; Si; Si micromechanical optical modulator; WDM fiber-to-the home systems; fabrication; fiber alignment; packaging configurations; Central office; Costs; Micromechanical devices; Optical modulation; Optical network units; Optical receivers; Optical waveguides; Packaging; Passive optical networks; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-3857-X
Type :
conf
DOI :
10.1109/ECTC.1997.606232
Filename :
606232
Link To Document :
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