DocumentCode
2080564
Title
Performance and packaging implications of a MEMS based optical modulator for WDM fiber-to-the home systems
Author
Walker, J.A. ; Ford, J.E. ; Basavanhally, N.
Author_Institution
AT&T Bell Labs., Holmdel, NJ, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
601
Lastpage
606
Abstract
Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute
Keywords
micromechanical devices; optical communication equipment; optical fibre subscriber loops; optical modulation; packaging; silicon; wavelength division multiplexing; 3.5 Mbit/s; MARS technology; MEMS based optical modulator; Si; Si micromechanical optical modulator; WDM fiber-to-the home systems; fabrication; fiber alignment; packaging configurations; Central office; Costs; Micromechanical devices; Optical modulation; Optical network units; Optical receivers; Optical waveguides; Packaging; Passive optical networks; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606232
Filename
606232
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