mini Ball Grid Array (mBGA) assembly on MCM-L boards

Author

Chanchani, Rajen ; Treece, Keith ; Dressendorfer, Paul

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1997

fDate

18-21 May 1997

Firstpage

656

Lastpage

663

Abstract

Sandia National Laboratories has developed a chip scale packaging technology called mini Ball Grid Array (mBGA). The mBGA is a flip chip die, obtained by redistributing peripheral pads in existing dies to an area array of pads 10 mils or larger in diameter with a minimum pitch of 20 mils. The peripheral pads are redistributed to area array pads using two polyimide dielectric and two metal conductor layers. mBGA can be closely tiled together on a substrate to yield a very high circuit density. In an earlier report, we presented the results on the reliability and thermal performance of mBGA on silicon and ceramic substrates. In this report, we present an mBGA cost analysis, improvement in the mBGA bump adhesion, and reliability and thermal performance of mBGA assemblies on FR-4 boards

Keywords

flip-chip devices; multichip modules; FR-4 board; MCM-L; Si; area array; bump adhesion; ceramic substrate; chip scale packaging technology; circuit density; cost analysis; flip chip die; metal conductor; mini Ball Grid Array assembly; peripheral pads; polyimide dielectric; reliability; silicon substrate; thermal performance; Assembly; Chip scale packaging; Circuits; Conductors; Dielectric substrates; Electronics packaging; Flip chip; Laboratories; Polyimides; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606241

Filename

606241