• DocumentCode
    2081429
  • Title

    Precision analysis of a multi-slice ultrasound sensor for non-invasive 3D kinematic analysis of knee joints

  • Author

    Masum, Md A. ; Lambert, Andrew J. ; Pickering, Mark R. ; Scarvell, Jennie M. ; Smith, Paul N.

  • Author_Institution
    Sch. of Eng. & Inf. Technol., Univ. of New South Wales at the Australian Defence Force Acad., Canberra, ACT, Australia
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    1137
  • Lastpage
    1140
  • Abstract
    Currently the standard clinical practice for measuring the motion of bones in a knee joint with sufficient precision involves implanting tantalum beads into the bones to act as fiducial markers prior to imaging using X-ray equipment. This procedure is invasive in nature and exposure to ionizing radiation imposes a cancer risk and the patient´s movements are confined to a narrow field of view. In this paper, an ultrasound based system for non-invasive kinematic evaluation of knee joints is proposed. The results of an initial analysis show that this system can provide the precision required for non-invasive motion analysis while the patient performs normal physical activities.
  • Keywords
    biomechanics; biomedical transducers; bone; kinematics; medical image processing; ultrasonic imaging; ultrasonic transducers; X-ray equipment; X-ray imaging; bone motion measurement; cancer; ionizing radiation; knee joints; multislice ultrasound sensor; noninvasive 3D kinematic analysis; noninvasive motion analysis; normal physical activity; patient movements; precision analysis; tantalum bead implantion; ultrasonic transducer; ultrasound based system; Bones; Image registration; Joints; Kinematics; Probes; Skin; Ultrasonic imaging; Biomechanical Phenomena; Female; Humans; Imaging, Three-Dimensional; Knee Joint; Male; Models, Biological; Ultrasonography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6346136
  • Filename
    6346136