DocumentCode :
2081695
Title :
Design and characterization of a high sensitive MEMS capacitive microphone using coupled membrane structure
Author :
Gharaei, H. ; Koohsorkhi, J. ; Saniei, F. ; Abbasi, Ali
Author_Institution :
Dept. of Mechatron. Eng., Univ. of Tehran, Tehran, Iran
fYear :
2013
fDate :
13-15 Feb. 2013
Firstpage :
374
Lastpage :
377
Abstract :
The micro scale high sensitive coupled membrane (HSCM) microphone has been reported in this paper and theoretically investigated. Membrane is one of the most important parts in micro electro mechanical microphones (MEMS microphone). In MEMS microphones, acoustic wave caused the membrane to deflect and become closer to the backplate. This deflection makes the surface of the membrane closer to the back plate and changes the capacity of the capacitor. This change is the main detection mechanism, used in the capacitive microphones (condenser microphones). Deflection of the membrane, caused its effective surface to decrease which negatively affects the sensitivity. Here, a design has been proposed to solve this problem and enhance the sensitivity of the microphone. In this design a special coupled diaphragm includes the two parts has been used. The first part is exposed to the acoustic wave and the second part, considered to be the moving electrode of the capacitor, is attached to the center of the first one, by means of an interface. This design provides the same deflection while keeps the effective surface unchanged.
Keywords :
capacitors; design engineering; electrodes; membranes; micromechanical devices; microphones; sensitivity; HSCM microphone; acoustic wave; back plate; capacitor capacity; coupled membrane structure; detection mechanism; electromechanical microphone; high sensitive MEMS capacitive microphone; high sensitive coupled membrane; moving electrode; sensitivity; Diffraction; Digital cameras; Finite element analysis; Micromechanical devices; Silicon; Capacitive Microphone; MEMS; Membrane;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Mechatronics (ICRoM), 2013 First RSI/ISM International Conference on
Conference_Location :
Tehran
Print_ISBN :
978-1-4673-5809-5
Type :
conf
DOI :
10.1109/ICRoM.2013.6510136
Filename :
6510136
Link To Document :
بازگشت