Title :
100-Gbit/s PDM-QPSK Integrated Coherent Receiver Front-End for Optical Communications
Author :
Murata, Koichi ; Saida, Takashi ; Ogawa, Ikuo ; Kasahara, Ryoichi ; Muramoto, Yoshifumi ; Fukuyama, Hiroyuki ; Sano, Kimikazu ; Nosaka, Hideyuki ; Kawakami, Hiroto
Author_Institution :
Photonics Labs., NTT Corp., Atsugi, Japan
Abstract :
This paper describes device and integration technologies for 100-Gbit/s polarization division multiplexed quadrature phase shift keying integrated coherent receiver front-end. The silica-based planar lightwave circuits for the optical passive circuits, InP-based photodiode for the opto-electrical conversion, and InP HBT for the transimpedance amplification are used to achieve high-performance. A module-level hybrid integration technology based on a chip-scale packaged O/E converter is applied as the integration technology. The fabricated receiver front-end has a wide dynamic range of around 20 dB with a constant local power of 13.5 dBm and an excellent common-mode rejection ratio of better than -25 dB up to 25 GHz.
Keywords :
III-V semiconductors; chip scale packaging; convertors; heterojunction bipolar transistors; indium compounds; integrated optics; integrated optoelectronics; multiplexing equipment; operational amplifiers; optical communication; optical receivers; passive networks; passive optical networks; photodiodes; quadrature phase shift keying; silicon compounds; HBT; InP; PDM-QPSK integrated coherent receiver front-end; SiO2; bit rate 100 Gbit/s; chip-scale packaged O-E converter; common-mode rejection ratio; module-level hybrid integration technology; optical communication; optical passive circuit; optoelectrical conversion; photodiode; planar lightwave circuit; polarization division multiplexing; quadrature phase shift keying; transimpedance amplification; Adaptive optics; Indium phosphide; Optical attenuators; Optical device fabrication; Optical polarization; Optical receivers;
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2011 IEEE
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-61284-711-5
Electronic_ISBN :
1550-8781
DOI :
10.1109/CSICS.2011.6062453
