Title :
Integration of thin film passive circuits using high/low dielectric constant materials
Author :
Chahal, P. ; Haridass, A. ; Pham, A. ; Tummala, R.R. ; Allen, M.G. ; Swaminathan, M. ; Laskar, J.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Integration of passives is a continuous challenge towards achieving high performance packages with low profile, improved reliability, maximum packaging efficiency and low cost. This paper discusses the design, fabrication and measurement of integrated passive structures using dielectric constants of 3.3 and 9.1, and thickness in the range of 10-21 μm for wireless applications. The use of polymer-ceramic composite material provides the design flexibility to combine both high dielectric constant and low dielectric constant materials within a single module. This allows for the design of matching networks, RF filters and ability to decouple power supplies for mixed signal applications with reduced size
Keywords :
composite materials; integrated circuit design; integrated circuit packaging; integrated circuit reliability; microwave integrated circuits; mixed analogue-digital integrated circuits; passive networks; permittivity; printed circuit design; 10 to 21 micron; RF filters; cost; design flexibility; dielectric constant; high performance packages; matching networks; mixed signal applications; packaging efficiency; polymer-ceramic composite material; power supply decoupling; profile; reliability; thin film passive circuits; wireless applications; Composite materials; Costs; Dielectric constant; Dielectric measurements; Dielectric thin films; Fabrication; Integrated circuit reliability; Packaging; Passive circuits; Thin film circuits;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606252
