Title :
130nm Single Event Upset Performance Evaluation: Commercial vs. Hardened by Design Architectures
Author :
Dumitru, Radu ; Hafer, Craig ; Wu, Tzu-Wen ; Rominger, Rob ; Milliken, Peter ; Bruno, Kevin ; Farris, Teresa
Author_Institution :
Aeroflex Colorado Springs, Colorado Springs, CO, USA
Abstract :
Two test chips have been built and SEE data has been collected to validate the radiation hardness of both commercial and Hardened-by-Design elements on a 130nm RadHard-by-Design ASIC Library.
Keywords :
application specific integrated circuits; radiation hardening (electronics); RadHard-by-design ASIC library; design architectures; hardened-by-design elements; radiation hardness; single event upset performance evaluation; size 130 nm; test chips; Clocks; Flip-flops; Libraries; Radiation effects; Single event upset; Springs; Transistors;
Conference_Titel :
Radiation Effects Data Workshop (REDW), 2011 IEEE
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4577-1281-4
DOI :
10.1109/REDW.2010.6062538
