Fluxless, no clean assembly of optoelectronic devices with PADS

Author

Nangalia, S. ; Koopman, N. ; Rogers, V. ; Beranek, M.W. ; Hager, H.E. ; Ledbury, E.A. ; Loebs, V.A. ; Miao, E.C. ; Tang, C.H. ; Pico, C.A. ; Swenson, E.J. ; Hatzis, D. ; Li, P. ; Luck, C.

Author_Institution

MCNC, Research Triangle Park, NC, USA

fYear

1997

fDate

18-21 May 1997

Firstpage

755

Lastpage

762

Abstract

MCNC has developed and is licensing a radically new fluxless, no-clean process that has enjoyed considerable success with a variety of soldering operations. This process is called PADS (Plasma Assisted Dry Soldering) and relies on a pretreatment which enables the subsequent solder reflow in inert, and even oxidizing ambients. Conventional mass production soldering tools can be used; just eliminate the flux dispense and flux cleaning steps and PADS pretreatment steps. This paper illustrates various soldering operations performed using PADS that could be used for assembly of optoelectronic devices. Examples include fiber optic module assembly/pigtailing, display module assembly (flip chip on glass), laser TAB attach of chips for flat panel displays, die bonding of transistors using lead free solder, seal ring attach for hermetic sealing of devices, and several related applications

Keywords

assembling; flat panel displays; flip-chip devices; microassembling; optical fibres; optoelectronic devices; reflow soldering; seals (stoppers); tape automated bonding; PADS; die bonding; display module assembly; fiber optic module assembly; flat panel displays; flip chip; fluxless process; hermetic sealing; laser TAB attach; mass production soldering tools; no clean assembly; optoelectronic devices; oxidizing ambients; pigtailing; plasma assisted dry soldering; pretreatment; seal ring attach; solder reflow; soldering operations; Assembly; Atherosclerosis; Cleaning; Flat panel displays; Licenses; Mass production; Optical fibers; Optoelectronic devices; Plasma devices; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606255

Filename

606255