Title :
Wafer scale photonic-die attachment
Author :
Zhou, Ping ; Boudreau, Robert ; Bowen, Terry
Author_Institution :
AMP Inc., Harrisburg, PA, USA
Abstract :
A new low cost manufacturing system has been established for the attachment of photonic dies such as lasers and photodetectors. This system is based on wafer scale photonic-die bonding technology-WSPD, recently developed at AMP. WSPD technology combines the passive alignment of optical elements on a silicon or glass wafer board, and fluxless local soldering technology. The approach provides the capability of low cost, high volume (speed), high precision die attachment for hybrid integration of optoelectronic device packaging
Keywords :
integrated circuit packaging; integrated optoelectronics; microassembling; photodetectors; reflow soldering; wafer-scale integration; Si; WSPD; fluxless local soldering technology; high precision die attachment; hybrid integration; lasers; optoelectronic device packaging; passive alignment; photodetectors; wafer scale photonic-die attachment; Costs; Glass; Manufacturing systems; Optoelectronic devices; Packaging; Photodetectors; Photonics; Silicon; Soldering; Wafer bonding;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606256
