DocumentCode
2083965
Title
Wafer scale photonic-die attachment
Author
Zhou, Ping ; Boudreau, Robert ; Bowen, Terry
Author_Institution
AMP Inc., Harrisburg, PA, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
763
Lastpage
767
Abstract
A new low cost manufacturing system has been established for the attachment of photonic dies such as lasers and photodetectors. This system is based on wafer scale photonic-die bonding technology-WSPD, recently developed at AMP. WSPD technology combines the passive alignment of optical elements on a silicon or glass wafer board, and fluxless local soldering technology. The approach provides the capability of low cost, high volume (speed), high precision die attachment for hybrid integration of optoelectronic device packaging
Keywords
integrated circuit packaging; integrated optoelectronics; microassembling; photodetectors; reflow soldering; wafer-scale integration; Si; WSPD; fluxless local soldering technology; high precision die attachment; hybrid integration; lasers; optoelectronic device packaging; passive alignment; photodetectors; wafer scale photonic-die attachment; Costs; Glass; Manufacturing systems; Optoelectronic devices; Packaging; Photodetectors; Photonics; Silicon; Soldering; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606256
Filename
606256
Link To Document