Title :
Fluxless die bonding of high power laser bars using the AuSn-metallurgy
Author :
Weiß, Stefan ; Bader, Volker ; Azdasht, Ghassem ; Kasulke, Paul ; Zakel, Elke ; Reichl, Herbert
Author_Institution :
Tech. Univ. Berlin, Germany
Abstract :
This paper presents a new concept for a fluxless package design for commercial high power laser bars. The laser bars are soldered on CuW heatsinks using Au(80)Sn(20) solder. Then a Cu lead is bonded with the FPC method (Fiber-Push-Connection) as a cap and electrical contact. Finally, the heatsink is mounted on a Cu microchannel cooler with Pb(37)Sn(63). We describe the mounting processes in detail, showing the large bonding window for soldering with Au(80)Sn(20), which is necessary for industrial production. The metallurgy of the Au(80)Sn(20) bonding interface is not dependent on the bond parameters in the area of the bonding window. Electro-optical characterizations show excellent performance of the laser bars. An accelerated aging test gives a first indicator of the high reliability of this package concept
Keywords :
cooling; gold alloys; heat sinks; life testing; microassembling; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; soldering; tin alloys; Au(80)Sn(20) solder; AuSn; AuSn metallurgy; Cu; Cu lead bonding; Cu microchannel cooler; CuW heatsinks; Pb(37)Sn(63); PbSn; accelerated aging test; electro-optical characterizations; fiber push connection method; fluxless die bonding; fluxless package design; high power laser bars; high reliability; industrial production; Bars; Bonding; Fiber lasers; Flexible printed circuits; Heat sinks; Lead; Microassembly; Optical design; Packaging; Power lasers;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606259
