DocumentCode
2084105
Title
Electrical modeling of extremely large packages
Author
Rubin, B.J. ; Mechentel, A. ; Magerlein, J.H.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
804
Lastpage
809
Abstract
Highly complex packages are analyzed by breaking them into large regions or blocks that are joined at their boundaries and solving for the currents using a moment method approach. Blocks are isolated from each other, except along the boundaries between blocks, and this serves to connect the blocks together. Full coupling is maintained within each block. The procedure is applied to structures where the coupling is expected to fall off rapidly, for instance in structures that have one or more contiguous reference planes and thus have nearby return currents. The examples involve a two-mesh-plane structure that contains one or more signal lines. The results are verified through a number of experiments and through comparison with known results for canonical transmission line structures
Keywords
method of moments; modelling; packaging; complex packages; electrical modeling; extremely large packages; moment method; two-mesh-plane structure; Circuit analysis; Coupling circuits; Equations; Frequency; Gaussian processes; Moment methods; Mutual coupling; Packaging; Solids; Supercomputers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606262
Filename
606262
Link To Document