• DocumentCode
    2084105
  • Title

    Electrical modeling of extremely large packages

  • Author

    Rubin, B.J. ; Mechentel, A. ; Magerlein, J.H.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    1997
  • fDate
    18-21 May 1997
  • Firstpage
    804
  • Lastpage
    809
  • Abstract
    Highly complex packages are analyzed by breaking them into large regions or blocks that are joined at their boundaries and solving for the currents using a moment method approach. Blocks are isolated from each other, except along the boundaries between blocks, and this serves to connect the blocks together. Full coupling is maintained within each block. The procedure is applied to structures where the coupling is expected to fall off rapidly, for instance in structures that have one or more contiguous reference planes and thus have nearby return currents. The examples involve a two-mesh-plane structure that contains one or more signal lines. The results are verified through a number of experiments and through comparison with known results for canonical transmission line structures
  • Keywords
    method of moments; modelling; packaging; complex packages; electrical modeling; extremely large packages; moment method; two-mesh-plane structure; Circuit analysis; Coupling circuits; Equations; Frequency; Gaussian processes; Moment methods; Mutual coupling; Packaging; Solids; Supercomputers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1997. Proceedings., 47th
  • Conference_Location
    San Jose, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3857-X
  • Type

    conf

  • DOI
    10.1109/ECTC.1997.606262
  • Filename
    606262