DocumentCode :
2084161
Title :
Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise
Author :
Vakanas, Loizos ; Hasan, Samil ; Cangellaris, Andreas ; Prince, John
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear :
1997
fDate :
18-21 May 1997
Firstpage :
826
Lastpage :
831
Abstract :
The effects of floating conductors in three-dimensional packaging structures are investigated. The simulations are based on a frequency-dependent integral equation formulation for the calculation of the magnetoquasistatic current distribution in complex interconnect structures. The calculated current distributions are used to develop an inductance/resistance equivalent circuit representation of the package that can be used as a subcircuit in SPICE for simultaneous switching noise calculations. The model is frequency dependent and captures the effect that multiple solid/meshed ground/power planes, pins, vias and traces have on overall package inductive performance. The impact of floating planes, such as a heat spreader under a BGA structure, on the mutual inductances of the structure is demonstrated. The frequency dependence of the floating plane effects is examined also. The behavior of the induced eddy currents in the floating plane is investigated also, particularly in the vicinity of interconnect discontinuities. Switching noise results obtained using SPICE simulation and the generated inductance/resistance equivalent package models show the effects of floating planes on switching noise
Keywords :
SPICE; current distribution; eddy currents; equivalent circuits; inductance; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; 3D packaging structures; BGA structure; SPICE simulation; complex interconnect structures; floating conductors; floating planes; frequency-dependent integral equation; heat spreader; induced eddy currents; inductance/resistance equivalent circuit; interconnect discontinuities; magnetoquasistatic current distribution; mutual inductances; package models; simultaneous switching noise; three-dimensional packaging structures; Circuit simulation; Conductors; Current distribution; Frequency dependence; Inductance; Integral equations; Integrated circuit interconnections; Noise generators; Packaging; SPICE;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-3857-X
Type :
conf
DOI :
10.1109/ECTC.1997.606265
Filename :
606265
Link To Document :
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