• DocumentCode
    2084961
  • Title

    Vascular stents with rationally-designed surface patterning

  • Author

    Gott, S.C. ; Jabola, B.A. ; Guanshui Xu ; Rao, M. Purnachandra

  • Author_Institution
    Mech. Eng. Dept., Univ. of California-Riverside, Riverside, CA, USA
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    1639
  • Lastpage
    1642
  • Abstract
    Herein, we discuss our recent progress towards realization of next-generation vascular stents that seek to mitigate adverse physiological responses to stenting via rational design of stent surface topography at the nanoscale. Specifically, we will discuss advances in patterning of deep sub-micrometer scale features in titanium (Ti) substrates, creation of cylindrical stents from micromachined planar Ti substrates, and integration of these processes to produce devices that will eventually allow evaluation of rationally-designed nanopatterning in physiologically-relevant contexts. We will also discuss results from mechanical testing and finite element modeling of these devices to assess their mechanical performance. These efforts represent key steps towards our long-term goal of developing a new paradigm for stents in which rationally-designed surface nanopatterning provides a physical means for complementing, or replacing, current pharmacological interventions.
  • Keywords
    finite element analysis; nanobiotechnology; nanopatterning; stents; surface topography; finite element modeling; mechanical performance; mechanical testing; micromachined planar substrate; nanopatterning; rationally designed surface patterning; stent surface topography; vascular stent; Fabrication; Steel; Substrates; Surface morphology; Surface topography; Surface treatment; Testing; Blood Vessel Prosthesis; Humans; Microscopy, Electron, Scanning; Prosthesis Design; Stents; Stress, Mechanical; Surface Properties; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6346260
  • Filename
    6346260