Title :
Signal transmission through human muscle for implantable medical devices using galvanic intra-body communication technique
Author :
Xi Mei Chen ; Peng Un Mak ; Sio Hang Pun ; Yue Ming Gao ; Mang I Vai ; Min Du
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Macau, Taipa, China
fDate :
Aug. 28 2012-Sept. 1 2012
Abstract :
Signal transmission over human tissues has long been the center research topic for biomedical engineering in both academic and industrial arenas. This is particular important for implantable medical devices (IMD) to communicate with other sensor devices in achieving health care and monitoring functions. Traditional Radio Frequency (RF) transmission technique suffers from not only high attenuation but also potential interference & eavesdropping. This paper has examined the alternate galvanic type Intra-Body Communication Technique (IBC) in transmitting signal across the body tissue (mainly muscle) in both analytical electromagnetic model with simulation results. Comparisons of these results with traditional RF data in literatures show a high promising potential (saving over 10 dB or more in path loss) for IBC transmission. Concrete discussions and several further research directions are also given out at the end of this paper.
Keywords :
bioelectric potentials; biomedical communication; health care; medical signal processing; muscle; patient monitoring; physiological models; prosthetics; electromagnetic model; galvanic intrabody communication technique; health care; health monitoring; human muscle; implantable medical devices; sensor devices; signal transmission; Biomedical monitoring; Humans; Implants; Mathematical model; Muscles; Radio frequency; Wireless communication; Computer Communication Networks; Computer Simulation; Humans; Models, Theoretical; Muscle, Skeletal; Prostheses and Implants; Signal Processing, Computer-Assisted; Surface Properties; Telemetry;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
DOI :
10.1109/EMBC.2012.6346263