DocumentCode
2085126
Title
WebTAFC-Web-based thermal simulator for flip-chip structures
Author
Petrov, Dmytro ; Fedasyuk, Dinytro
Author_Institution
Dept. of CAD, Nat. Univ. "Lvivska Polytechnica", Lviv, Ukraine
fYear
2001
fDate
12-17 Feb. 2001
Firstpage
157
Lastpage
159
Abstract
The WebTAFC thermal simulator developed by the authors and intended for the thermal analysis of flip-chip structures is presented in the paper. The simulator can be used in Internet/Intranet and provides the user interface via a conventional Web-browser.
Keywords
Internet; circuit simulation; flip-chip devices; integrated circuit modelling; integrated circuit packaging; online front-ends; thermal analysis; thermal management (packaging); user interfaces; Internet simulation; Intranet simulation; Web-browser; WebTAFC Web-based thermal simulator; WebTAFC thermal simulator; flip-chip structures; thermal analysis; user interface; Analytical models; Collaboration; Computational modeling; Continents; Design automation; Internet; Microelectronics; Semiconductor device packaging; User interfaces; Web server;
fLanguage
English
Publisher
ieee
Conference_Titel
CAD Systems in Microelectronics, 2001. CADSM 2001. Proceedings of the 6th International Conference. The Experience of Designing and Application of
Conference_Location
Lviv-Slavsko, Ukraine
Print_ISBN
966-553-079-8
Type
conf
DOI
10.1109/CADSM.2001.975792
Filename
975792
Link To Document