Title :
Solving heat conduction problems in Mathematica environment
Author :
Mykhalchuk, Myroslav ; Fedasyuk, Dmytro
Author_Institution :
CAD Dept., Nat. Univ. Lvivska Polytechnica, Lviv, Ukraine
Abstract :
The aim of this paper is to demonstrate benefits of applying innovative symbolic computation tools to solving heat conduction problems that often arise in engineering practice. Wolfram Research´s Mathematica 4.0 application was used, For demonstration purposes a transient nonlinear problem in a 2D square area. was chosen, as a frequently encountered one in thermal design of microelectronics, although the approach is readily extensible to a wide range of problems. The paper further extends the insights and developments.
Keywords :
digital simulation; heat conduction; symbol manipulation; thermal management (packaging); transient analysis; 2D square area; Mathematica environment; engineering practice; heat conduction problems; microelectronics; symbolic computation tools; thermal design; transient nonlinear problem; Boundary conditions; Differential equations; Displays; Eigenvalues and eigenfunctions; Packaging; Partial differential equations; Physics computing; Symmetric matrices; Temperature distribution; Transforms;
Conference_Titel :
CAD Systems in Microelectronics, 2001. CADSM 2001. Proceedings of the 6th International Conference. The Experience of Designing and Application of
Conference_Location :
Lviv-Slavsko, Ukraine
Print_ISBN :
966-553-079-8
DOI :
10.1109/CADSM.2001.975794
