• DocumentCode
    2085180
  • Title

    Split: Optimizing Space, Power, and Throughput for TCAM-Based Classification

  • Author

    Meiners, Chad R. ; Liu, Alex X. ; Torng, Eric ; Patel, Jignesh

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
  • fYear
    2011
  • fDate
    3-4 Oct. 2011
  • Firstpage
    200
  • Lastpage
    210
  • Abstract
    Using Ternary Content Addressable Memories (TCAMs) to perform high-speed packet classication has become the de facto standard in industry because TCAMs facilitate constant time classication by comparing packet elds against ternary encoded rules in parallel. Despite their high speed, TCAMs have limitations of small capacity, large power consumption, and relatively slow access times. One reason TCAM-based packet classiers are so large is the multiplicative eect inherent in representing d-dimensional classiers in TCAMs. To address the multiplicative effect, we propose the TCAM Split architecture, where a d-dimensional classier is split into k = 2 low dimensional classiers, each of which is stored on its own small TCAM. A d-dimensional lookup is split into k low dimensional, pipe-lined lookups with one lookup on each chip. Our experimental results with real-life classiers show that TCAM Split reduces classier size by 84% using only two small TCAM chips, this increases to 93% if we use ve small TCAM chips.
  • Keywords
    IP networks; content-addressable storage; optimisation; pattern classification; ternary codes; TCAM SPliT architecture; TCAM based classification; TCAM chips; constant time classification; high speed packet classification; power optimization; space optimization; ternary content addressable memories; ternary encoded rules; throughput optimization; Encoding; Fires; IP networks; Pipelines; Protocols; Random access memory; Throughput; Packet Classification; TCAM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Architectures for Networking and Communications Systems (ANCS), 2011 Seventh ACM/IEEE Symposium on
  • Conference_Location
    Brooklyn, NY
  • Print_ISBN
    978-1-4577-1454-2
  • Electronic_ISBN
    978-0-7695-4521-9
  • Type

    conf

  • DOI
    10.1109/ANCS.2011.36
  • Filename
    6062732