Investigation of spurious coupling influence on the quality of the microelectronic equipment

With the increasing of integration degree, operating speed and packing density of microelectronic devices on the basis of microassemblies and hybrid silicon modules, besides ensuring thermal stability, manufacturability and mechanical strength, it is necessary to solve the problem of guaranteeing noise-immunity and electromagnetic compatibility of devices. The existing software of electrical, thermal and mechanical process modelling in most cases leaves out of the account spurious coupling. However, during the constructional realization of any electronic scheme, the consideration of supplementary spurious coupling is inevitable.